Senior Mechanical Engineer, Thermal Interface Material Integration

Boston Materials

Billerica, MA, USA

Posted on: 2026-01-13

Category: materials

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Employment type:

Full time

Experience required:

Senior

Salary

Salary not provided

About the company:

Founded in 2016, Boston Materials is a high-performance materials company that enables manufacturers of industrial and consumer products to break through their design trade-offs with new materials.

The company's patented Z-axis Fiber™ is a lightweight material that has an extraordinary ability to diffuse energy (thermal, electrical, structural). It is produced from reclaimed carbon fiber, enabling new, high-volume, energy-efficient products that have a low carbon footprint. Key applications include vehicle lightweighting and electronics thermal management.

By turning a $2B per year waste stream into high-value, advanced materials, Boston Materials is enabling the next generation of products and unlocking a circular economy.

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed for the most demanding AI Infrastructure. Boston Materials is committed to expanding high-volume manufacturing in the United States. For more information, visit https://www.bomaterials.com/

ABOUT THE OPPORTUNITY

Not often in one’s career do we get the chance to—

Get close to the mission. Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the company’s success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.

Move faster. Adapting to changes in the market at record speed. No multi-layer signoffs and approvals. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas— and are encouraged to do so. We create solutions to problems that our customers truly care about, and we understand that customers won’t wait for us to figure them out.

Branch beyond the role. We’re not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, we’re able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.

Create critical solutions. Join us to solve the most critical challenges facing the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.

Opportunity knocks at Boston Materials. Will you answer the call?

The Role

We are seeking a highly motivated Senior Mechanical Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.

Join us to solve one of the most critical challenges facing the Semiconductor and Electronics Industry – thermal management!

Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.

Applicants must be currently authorized to work in the US on a full-time basis.

Your Responsibilities

Lead internal design and development efforts to integrate our liquid-metal based thermal interface materials into customer-specific electronic packages.

Build and test package and provision assembly mockups to demonstrate design feasibility, which may include mechanical and reliability testing.

Document designs for both fabrication and customer coordination. Lead effort to fabricate provisions either internally or externally in support of customer schedules.

Support R&D team in continuous improvement of system performance.

Act as the primary technical point of contact for ODM, OSAT, and hyperscaler customer technical teams during early and mid-stage engagement.

Work closely with business development team to uncover and document customer technical requirements, including geometric, load, assembly, environmental constraints, thermal budgets, and reliability standards.

Prepare and deliver technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes.

Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.

Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.

Your Skills and Expertise

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.

CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation.

3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company.

Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.).

Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.

Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.

Experience with design and fabrication of elastomeric materials is a plus.

Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.